Title:
METHOD FOR MANUFACTURING ELECTRONIC DEVICE, CONDUCTIVE FILM, FIRST LAMINATE, AND SECOND LAMINATE
Document Type and Number:
WIPO Patent Application WO/2024/014528
Kind Code:
A1
Abstract:
This method for manufacturing an electronic device comprises: a preparation step for preparing a first laminate, which includes a first surface and a second surface positioned on the side opposite to the first surface, the first laminate including at least a base material and a conductive film which are provided side by side from the first surface toward the second surface; a suction step for electrostatically suctioning the second surface of the first laminate by using an electrostatic chuck; a deposition step for depositing a material on the first surface of the first laminate via a mask; and a peeling step for peeling the conductive film from the base material.
Inventors:
ISOJIMA SEIICHI (JP)
SAKAYORI KATSUYA (JP)
SAKAYORI KATSUYA (JP)
Application Number:
PCT/JP2023/026012
Publication Date:
January 18, 2024
Filing Date:
July 14, 2023
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD (JP)
International Classes:
H10K71/80; B32B9/00; C23C14/12; C23C14/24; G09F9/30; H01B5/14; H10K50/10; H10K59/10; H10K71/16; H10K71/60; H10K77/10
Foreign References:
| JP2022033147A | 2022-02-28 | |||
| JP2010027652A | 2010-02-04 | |||
| JP2022008796A | 2022-01-14 | |||
| JP2007027315A | 2007-02-01 |
Attorney, Agent or Firm:
MIYAJIMA Manabu et al. (JP)
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