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Patent Searching and Data


Title:
METHOD FOR MANUFACTURING COVER MEMBER, AND COVER MEMBER STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2020/189947
Kind Code:
A1
Abstract:
A method for manufacturing a cover member for electronic devices according to various embodiments of the present disclosure may comprise: a step for forming a magnesium plate; a step for performing primary CNC processing on the magnesium plate using a specified cutting oil; a step for performing a primary pretreatment on the magnesium plate using chromate or micro arc oxidation (MAO); a step for performing a primary surface-treatment on the magnesium plate by bake-coating or electrodeposition coating; a step for performing secondary CNC processing on a first region of the magnesium plate using an alcohol-containing cutting oil; a washing and drying step; a step for performing a secondary pretreatment for preventing oxidation on the first region; and a step for performing a secondary surface-treatment on the first region by bake-coating or electrodeposition coating.

Inventors:
KIM HYUNSOO (KR)
LEE SOOKYU (KR)
LIM JAEWOONG (KR)
Application Number:
PCT/KR2020/003357
Publication Date:
September 24, 2020
Filing Date:
March 11, 2020
Export Citation:
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Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
C25D13/22; B23Q11/10; C23C22/24; C23C24/08; C23G5/032; C25D11/02; C25D11/30; C25D11/38; C25D13/04; C25D13/20
Foreign References:
KR20130068526A2013-06-26
KR20170070636A2017-06-22
KR20030040824A2003-05-23
KR101303854B12013-09-04
US20170347476A12017-11-30
Attorney, Agent or Firm:
LEE, Keon-Joo et al. (KR)
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