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Title:
METHOD FOR FORMING HOLE TRANSPORT LAYER ON SURFACE OF SUBSTRATE, AND HOLE TRANSPORT LAYER, SOLAR CELL AND PREPARATION METHOD THEREFOR, AND PHOTOVOLTAIC MODULE
Document Type and Number:
WIPO Patent Application WO/2023/087310
Kind Code:
A1
Abstract:
Provided in the present application are a method for forming a hole transport layer on the surface of a substrate, and a hole transport layer, a solar cell and a preparation method therefor, and a photovoltaic module. The method for forming a hole transport layer on the surface of a substrate comprises the steps of: providing M target materials, each of which comprises an inorganic hole transport material; and forming, on the surface of a substrate and by using a magnetron sputtering principle, a hole transport layer which at least comprises N consecutive sub-layers, wherein 2 ≤ N ≤ M, and at least one of the M target materials is a doped target material further comprising a doped material. By means of the present application, the stability and the consistency of the solar cell can be better, and an energy level structure of a hole transport layer in the solar cell can further be conveniently adjusted, thereby facilitating the energy level matching and optimization between a light absorption layer and the hole transport layer.

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Inventors:
CHEN GUODONG (CN)
GUO YONGSHENG (CN)
LIN WEILE (CN)
WANG YANDONG (CN)
LIU ZHAOHUI (CN)
Application Number:
PCT/CN2021/132108
Publication Date:
May 25, 2023
Filing Date:
November 22, 2021
Export Citation:
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Assignee:
CONTEMPORARY AMPEREX TECHNOLOGY CO LTD (CN)
International Classes:
C23C14/35; H01L31/18; H01L31/0336
Foreign References:
CN113410321A2021-09-17
CN106024927A2016-10-12
CN110444611A2019-11-12
CN109065659A2018-12-21
AU2020100802A42020-06-25
Other References:
See also references of EP 4228011A4
Attorney, Agent or Firm:
BEIJING EAST IP LTD. (CN)
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