METHOD FOR EXTRACTING PART IN PACKAGING STRUCTURE, AND GRINDING FIXTURE

Title:

METHOD FOR EXTRACTING PART IN PACKAGING STRUCTURE, AND GRINDING FIXTURE

Document Type and Number:

WIPO Patent Application WO/2024/040804

Kind Code:

A1

Abstract:

A method for extracting a part (12) in a packaging structure (11), and a grinding fixture (10). The method for extracting the part (12) comprises the following steps: putting an adhesive in the grinding fixture (10), and softening the adhesive; putting the packaging structure (11) in the adhesive, making the surface of the packaging structure (11) on which a circuit board is packaged face upwards, and curing the adhesive; grinding the packaging structure (11) until the part (12) is exposed; and softening the adhesive, and removing the part (12).

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Inventors:

MAO NING (CN)
LIU QINGGEN (CN)
LI ZHUO (CN)
HUANG SHANYU (CN)
WANG WEIXIN (CN)

Application Number:

PCT/CN2022/139047

Publication Date:

February 29, 2024

Filing Date:

December 14, 2022

Export Citation:

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Assignee:

WINGTECH MOBILE COMMUNICATIONS CO LTD (CN)

International Classes:

B09B3/35

Foreign References:

CN113008643A	2021-06-22
CN107894359A	2018-04-10
CN102468122A	2012-05-23
CN104810243A	2015-07-29
CN106505003A	2017-03-15
CN106971952A	2017-07-21

Attorney, Agent or Firm:

GUANGZHOU DEKE INTELLECTUAL PROPERTY AGENT LTD. (CN)

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