Title:
METHOD AND DEVICE FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/080148
Kind Code:
A1
Abstract:
Provided is a method for manufacturing a semiconductor device , the method involving: using a semiconductor element to be inspected as a first semiconductor element, and using a semiconductor element for acquiring teaching data as a second semiconductor element to acquire the teaching data including a plurality of pieces of data pertaining to the characteristics of the second semiconductor element; using the teaching data to create a trained model; and determining whether to electrically inspect the first semiconductor element on the basis of an output obtained by inputting a plurality of pieces of data pertaining to the first semiconductor element to the trained model.
Inventors:
MORINO TOMOO (JP)
IWATSUKI MASAYUKI (JP)
IWATSUKI MASAYUKI (JP)
Application Number:
PCT/JP2023/035258
Publication Date:
April 18, 2024
Filing Date:
September 27, 2023
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
G01R31/26; H01L21/66
Domestic Patent References:
| WO2019059011A1 | 2019-03-28 | |||
| WO2022227018A1 | 2022-11-03 |
Foreign References:
| JP2021143880A | 2021-09-24 | |||
| JP2016006392A | 2016-01-14 | |||
| JP2005150727A | 2005-06-09 | |||
| JP2022136931A | 2022-09-21 | |||
| JP2022089450A | 2022-06-16 | |||
| US20200064275A1 | 2020-02-27 |
Attorney, Agent or Firm:
YOU-I PATENT FIRM (JP)
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