Title:
METHOD FOR CREATING CORRELATIONAL EXPRESSION FOR POLISHING CONDITION DETERMINATION
Document Type and Number:
WIPO Patent Application WO/2022/239376
Kind Code:
A1
Abstract:
A method for creating correlational expression for polishing condition determination, the method comprising: polishing a semiconductor wafer on the basis of a plurality of polishing conditions including a plurality of polishing parameters, and acquiring, through actual measurement, in-plane polishing amount distribution information of the semiconductor wafer polished on the basis of the plurality of polishing conditions; polishing a semiconductor wafer on the basis of the polishing conditions including the plurality of polishing parameters, and acquiring, through actual measurement, polishing-time in-plane temperature distribution information of the semiconductor wafer polished on the basis of the plurality of polishing conditions, or creating, through heat transfer analysis, the polishing-time in-plane temperature distribution information of the semiconductor wafer polished on the basis of the polishing conditions including the plurality of polishing parameters; creating a correlational expression 1 between the plurality of polishing parameters and an in-plane temperature distribution parameter for the semiconductor wafer on the basis of the polishing-time in-plane temperature distribution information; creating a correlational expression 2 between the plurality of polishing parameters and an in-plane polishing amount distribution parameter for the semiconductor wafer on the basis of the in-plane polishing amount distribution information; and creating a correlational expression 3 between the plurality of polishing parameters and the in-plane polishing amount distribution parameter for the semiconductor wafer on the basis of the the correlational expression 1 and the correlational expression 2, wherein the correlational expression 3 is to be used for determining polishing conditions for actually polishing the semiconductor wafer.
Inventors:
NAKANO YUKI (JP)
Application Number:
PCT/JP2022/008115
Publication Date:
November 17, 2022
Filing Date:
February 28, 2022
Export Citation:
Assignee:
SUMCO CORP (JP)
International Classes:
B24B37/005; B24B49/14; H01L21/304
Foreign References:
| JP2020131353A | 2020-08-31 | |||
| US20090170320A1 | 2009-07-02 | |||
| JP2015168015A | 2015-09-28 | |||
| JP2008177266A | 2008-07-31 | |||
| JPH10128655A | 1998-05-19 | |||
| JP2007181910A | 2007-07-19 | |||
| JP2020109839A | 2020-07-16 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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