METAL PARTICLE-CONTAINING COMPOSITION, PASTE FOR BONDING AND BONDED BODY

WIPO Patent Application WO/2023/248311

A1

The present invention provides: a metal particle-containing composition which enables a bonded part to have a high bonding strength, while suppressing a decrease in the bonding strength associated with thermal cycles; and a paste for bonding. The present invention also provides a paste for bonding, which has, in addition to the above-described characteristics, excellent printability to a part to be bonded even if metal particles are contained therein at a high concentration. The present invention also provides a bonded body which is not deteriorated by thermal cycles. The present invention provides a metal particle-containing composition which contains: metal particles (A) that have an average particle diameter of 100 nm to 500 nm; and a compound (B) that has 20 to 80 carbon atoms, while having two or more functional groups (b), each of which is at least one group that is selected from among a hydroxyl group, a carboxy group and an amino group. The present invention also provides a paste for bonding, the paste containing a dispersion medium (C) and the metal particle-containing composition. The present invention also provides a bonded body which is obtained by bonding a first part to be bonded and a second part to be bonded by means of the above-described paste for bonding.

UESUGI TAKAHIKO (JP)
TANAKA NAOHIRO (JP)

PCT/JP2022/024595

December 28, 2023

June 20, 2022

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TOYO INK SC HOLDINGS CO LTD (JP)

B22F1/10; B22F1/00; B22F9/00; B23K35/22; B23K35/363

JP2018109232A	2018-07-12
JP2022060054A	2022-04-14
JP2018156736A	2018-10-04
JP2022098527A	2022-07-04

IEIRI Takeshi (JP)

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