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Patent Searching and Data


Title:
MEMS MICROPHONE
Document Type and Number:
WIPO Patent Application WO/2021/134334
Kind Code:
A1
Abstract:
The present application provides an MEMS microphone, comprising a substrate having a back cavity and a capacitance system arranged on the substrate. The capacitance system comprises a diaphragm, and a back plate spaced apart from the diaphragm and forming a cavity with the diaphragm; the MEMS microphone is further provided with a supporting frame located between the back plate and the diaphragm, one end of the supporting frame is connected to the back plate, and the other end thereof is connected to the diaphragm; the cavity is divided into a first cavity in the middle and a second cavity on the periphery by the supporting frame; the supporting frame is provided with a communicating channel for communicating the first cavity with the second cavity. In a production process of the MEMS microphone, an etching agent can enter the first cavity from sound amplification holes on the back plate and then enter the second cavity from the communicating channel, so that an oxide in the cavity formed between the back plate and the diaphragm is completely corroded, thereby avoiding affecting the use of the MEMS microphone when the oxide is left in the microphone product.

Inventors:
WANG LINLIN (CN)
ZHONG XIAOHUI (CN)
ZHANG RUI (CN)
MENG ZHENKUI (CN)
Application Number:
PCT/CN2019/130164
Publication Date:
July 08, 2021
Filing Date:
December 30, 2019
Export Citation:
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Assignee:
AAC ACOUSTIC TECH SHENZHEN CO LTD (CN)
International Classes:
H04R19/04
Domestic Patent References:
WO2018207578A12018-11-15
Foreign References:
CN107244646A2017-10-13
CN206948616U2018-01-30
CN104541521A2015-04-22
Attorney, Agent or Firm:
GUANGZHOU YUEXIU JILY PATENT & TRADEMARK LAW OFFICE (CN)
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