Title:
MEMS MICROPHONE CHIP
Document Type and Number:
WIPO Patent Application WO/2022/110270
Kind Code:
A1
Abstract:
Provided is an MEMS microphone chip. The MEMS microphone chip comprises a base having a back cavity, and a capacitor structure arranged on the base, wherein the capacitor structure comprises a vibrating diaphragm fixed to the base, and a back plate arranged spaced apart from the vibrating diaphragm; at least one of the side of the back plate that is close to the vibrating diaphragm and the side of the vibrating diaphragm that is close to the base is provided with an insulating protrusion; and the insulating protrusion comprises a plurality of first protrusion portions and second protrusion portions that are arranged at intervals, and the height of the first protrusion portions is greater than the height of the second protrusion portions. By means of the present utility model, the adhesion between a vibrating diaphragm and a back plate or a base can be effectively reduced, thereby preventing a failure from occurring on a microphone.
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Inventors:
ZHAO ZHUANZHUAN (CN)
BAI YANG (CN)
ZHANG RUI (CN)
BAI YANG (CN)
ZHANG RUI (CN)
Application Number:
PCT/CN2020/133745
Publication Date:
June 02, 2022
Filing Date:
December 04, 2020
Export Citation:
Assignee:
AAC ACOUSTIC TECH SHENZHEN CO LTD (CN)
International Classes:
H04R19/04; H04R7/04
Foreign References:
| CN205491150U | 2016-08-17 | |||
| CN105282671A | 2016-01-27 | |||
| CN105323687A | 2016-02-10 | |||
| US20150189444A1 | 2015-07-02 | |||
| US20180020275A1 | 2018-01-18 |
Attorney, Agent or Firm:
HENSEN INTELLECTUAL PROPERTY FIRM (CN)
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