Title:
MEMORY SYSTEM
Document Type and Number:
WIPO Patent Application WO/2023/236258
Kind Code:
A1
Abstract:
The embodiments of the present disclosure relate to the field of semiconductors. Provided is a memory system. The memory system comprises: a basic chip and a plurality of stacked memory chips, wherein each memory chip comprises a plurality of memory cells. The memory system is provided with a plurality of channels, wherein each channel comprises some memory cells in all the memory chips, each channel partially corresponds to a memory chip, and each channel is electrically connected to the basic chip. The memory system further comprises: a temperature processing module, which is configured to acquire a plurality of first temperature codes corresponding to the memory chips, acquire a second temperature code that represents the temperature of the basic chip, compare the plurality of first temperature codes with the second temperature code, and output a high-temperature representation code, wherein each first temperature code represents the maximum temperature value of parts of all channels corresponding to the corresponding memory chip, and the high-temperature representation code is one of the first temperature code and the second temperature code that represents a higher temperature. The embodiments of the present disclosure are at least conducive to monitoring the temperature in a memory system.
Inventors:
CHENG WEIJIE (CN)
Application Number:
PCT/CN2022/100924
Publication Date:
December 14, 2023
Filing Date:
June 23, 2022
Export Citation:
Assignee:
CHANGXIN MEMORY TECH INC (CN)
International Classes:
G11C11/406
Foreign References:
| US20190161341A1 | 2019-05-30 | |||
| CN109074831A | 2018-12-21 | |||
| CN106057233A | 2016-10-26 | |||
| US20160162219A1 | 2016-06-09 |
Attorney, Agent or Firm:
SHANGHAI CHENHAO INTELLECTUAL PROPERTY LAW FIRM GENERAL PARTNERSHIP (CN)
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