Title:
MEMORY CHIP, MEMORY DEVICE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/078102
Kind Code:
A1
Abstract:
The present application relates to a memory chip, a memory device and an electronic device. The memory chip (20) comprises a plurality of memory units (210), each memory unit (210) comprising a substrate (21) and a plurality of memory sub-units (22), and the plurality of memory sub-units (22) being stacked on the substrate (21). Each memory sub-unit (22) comprises memory layers (220) and insulating layers (224), which are alternately stacked; and a first electrode (221) passing through the memory layers (220) and the insulating layers (224). Each memory layer (220) comprises a memory portion (223) for storing data and a second electrode (222). Each first electrode (221) is electrically connected to the memory portions (223) of all the memory layers (220) of the memory sub-units (22). The first electrodes (221) and the second electrodes (222) are used for connecting to a peripheral circuit, so as to control access of data in the memory portions by means of the peripheral circuit. The plurality of memory sub-units in the present application may be independent structures which can be independently manufactured, thereby lowing the difficulty of manufacturing memory chips.
Inventors:
WU QUANTAN (CN)
LI XIANG (CN)
CHEN YIFENG (CN)
LI XIANG (CN)
CHEN YIFENG (CN)
Application Number:
PCT/CN2023/110919
Publication Date:
April 18, 2024
Filing Date:
August 03, 2023
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
G11C5/02
Attorney, Agent or Firm:
SCIHEAD IP LAW FIRM (CN)
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