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Title:
MEMBER FOR SEMICONDUCTOR MANUFACTURING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2024/023919
Kind Code:
A1
Abstract:
A wafer mounting stage 10, which is one example of a member for a semiconductor manufacturing apparatus, comprises a ceramic plate 20, a ceramic plate through hole 24, a base plate 30, a base plate through hole 34, an insulation sleeve 50, and a sleeve through hole 54. The sleeve through hole 54 penetrates the insulation sleeve 50 in the vertical direction and communicates with the ceramic plate through hole 24. The insulation sleeve 50 is bonded to the base plate through hole 34 via a bonding layer 60. The insulation sleeve 50 includes a tool engagement section (female thread section 52) capable of engaging with an external tool. When engaged with the external tool, the tool engagement section transfers the rotational torque of the external tool to the insulation sleeve 50.

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Inventors:
INOUE SEIYA (JP)
KUNO TATSUYA (JP)
HIRATA NATSUKI (JP)
YONEMOTO KENJI (JP)
Application Number:
PCT/JP2022/028748
Publication Date:
February 01, 2024
Filing Date:
July 26, 2022
Export Citation:
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Assignee:
NGK INSULATORS LTD (JP)
International Classes:
H01L21/3065; H01L21/683
Domestic Patent References:
WO2018216797A12018-11-29
WO2019131115A12019-07-04
Foreign References:
JPS5739924A1982-03-05
JP2013191626A2013-09-26
Attorney, Agent or Firm:
ITEC INTERNATIONAL PATENT FIRM (JP)
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