Title:
MANUFACTURING METHOD FOR TRANSPARENT CONDUCTIVE FILM
Document Type and Number:
WIPO Patent Application WO/2023/042842
Kind Code:
A1
Abstract:
A manufacturing method for a transparent conductive film (3) comprises: a first step for preparing a long substrate (1); a second step for forming, in a vacuum atmosphere, a transparent conductive layer (2) on one surface in the thickness direction of the substrate (1); and a third step for heating, in a vacuum atmosphere, the transparent conductive layer (2) by using a heating roll (22).
Inventors:
KARASUDA TAISUKE (JP)
FUJINO NOZOMI (JP)
TAKAO HIROYUKI (JP)
FUJINO NOZOMI (JP)
TAKAO HIROYUKI (JP)
Application Number:
PCT/JP2022/034344
Publication Date:
March 23, 2023
Filing Date:
September 14, 2022
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
H01B13/00; B32B7/023; B32B7/025; B32B9/00; C23C14/08; C23C14/56; H01B1/20; H01B5/14
Foreign References:
| JP2013140684A | 2013-07-18 |
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (JP)
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