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Patent Searching and Data


Title:
MANIFOLD FLUID MODULE
Document Type and Number:
WIPO Patent Application WO/2024/014739
Kind Code:
A1
Abstract:
The present invention relates to a manifold fluid module. The manifold fluid module according to an embodiment of the present invention integrates, in a heat management system consisting of a compressor, a plurality of heat exchangers, a plurality of valves, and an expansion valve, at least one of the heat exchangers, at least one of the valves, and the expansion valve into one, and comprises: a manifold plate having a plurality of fluid passages formed therein; a low-temperature fluid passage, among the plurality of fluid passages, through which heat-exchanged low-temperature fluid moves and to which a plurality of fluid inlets and one fluid outlet are connected; and an evaporator inlet port via which one of the plurality of fluid inlets is connected to an evaporator outlet, wherein the evaporator inlet port may be disposed on the low-temperature fluid passage.

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Inventors:
KANG IN KEUN (KR)
KIM YOUNG MAN (KR)
KIM IN HYEOK (KR)
KIM JAE KYUN (KR)
LEE KYEONG CHEOL (KR)
LEE JAE MIN (KR)
Application Number:
PCT/KR2023/008748
Publication Date:
January 18, 2024
Filing Date:
June 23, 2023
Export Citation:
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Assignee:
HANON SYSTEMS (KR)
International Classes:
B60H1/32; B60H1/00; F25B43/00
Foreign References:
US20190039440A12019-02-07
JP2008111624A2008-05-15
JPH10103893A1998-04-24
CN113276630A2021-08-20
US20210086587A12021-03-25
Attorney, Agent or Firm:
DANA PATENT LAW FIRM (KR)
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