Title:
MACHINING CONTROL METHOD FOR SEMICONDUCTOR DEVICE, AND HIGH-ENERGY PARTICLE BEAM LITHOGRAPHY DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/077416
Kind Code:
A1
Abstract:
The present invention relates to a machining control method for a semiconductor device, and a high-energy particle beam lithography device. The machining control method for a semiconductor device comprises: acquiring an integrated circuit layout corresponding to a target semiconductor device; respectively converting several layers of integrated circuit sub-layouts into grayscale pictures of a preset format; according to preset correspondences between high-energy particle beam machining parameters and grayscale values, acquiring high-energy particle beam machining parameters corresponding to pixel points in the grayscale pictures; and sequentially making each corresponding material layer on a target base material, and according to the high-energy particle beam machining parameters corresponding to the pixel points in the grayscale pictures, respectively controlling a high-energy particle beam lithography device to emit high-energy particle beams and to make same act on corresponding material layers on the target base material, and engraving patterns corresponding to the integrated circuit sub-layouts onto the corresponding material layers on the target base material, so as to obtain the target semiconductor device. Compared with the prior art, the present application does not need to use an integrated circuit mask, thus improving the engraving effect and the machining efficiency, and reducing the production cost.
Inventors:
ZHANG QIHUA (CN)
CHIEN WEI-TING KARY (CN)
HONG LIU (CN)
YUAN YUAN (CN)
ZHANG YONGWEI (CN)
JIANG JUNHAO (CN)
ZHANG JIE (CN)
ZHANG YANG (CN)
CHIEN WEI-TING KARY (CN)
HONG LIU (CN)
YUAN YUAN (CN)
ZHANG YONGWEI (CN)
JIANG JUNHAO (CN)
ZHANG JIE (CN)
ZHANG YANG (CN)
Application Number:
PCT/CN2022/124110
Publication Date:
April 18, 2024
Filing Date:
October 09, 2022
Export Citation:
Assignee:
YUAN YUAN (CN)
International Classes:
H01L21/033; H01J37/317
Foreign References:
| CN114927410A | 2022-08-19 | |||
| CN110033441A | 2019-07-19 | |||
| CN114089607A | 2022-02-25 | |||
| US20210327678A1 | 2021-10-21 |
Attorney, Agent or Firm:
GUANGZHOU JUNCY INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
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