Title:
LOW-PROFILE ELECTROLYTIC COPPER FOIL FOR HIGH-DENSITY INTERCONNECTION CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2022/110536
Kind Code:
A1
Abstract:
The present invention relates to the field of copper foil, and in particular to low-profile electrolytic copper foil for a high-density interconnection circuit board. The electrolytic copper foil sequentially comprises a copper foil layer, a roughening treatment layer, a protective barrier layer, a passivation layer and a silane coupling agent layer, wherein the copper foil layer has a thickness of 6-35μm, a weight per unit area of 50-305 g/m2 with a weight deviation per unit area less than 5%, a tensile strength more than or equal to 350 N/mm2 at 25°C, an elongation more than or equal to 4% at 25°C, a peeling strength more than or equal to 0.7 kg/cm, a roughness of a smooth surface Ra less than or equal to 0.43μm, and a roughness of a rough surface Rz less than or equal to 3.5μm. The electrolytic copper foil provided in the present invention has simple raw materials, is non-toxic and harmless, safe and environment-friendly, has an excellent room-temperature tensile strength and a high-temperature tensile strength, can endure a high temperature of 200°C and has both a good flatness and a low profile, is simple in terms of operation, can completely meet market requirements for electrolytic copper foil for a high-density interconnection circuit board, and has a high added value, a broad environmental applicability and remarkable market competitiveness.
Inventors:
WANG JUNFENG (CN)
LIAO PINGYUAN (CN)
GUO ZHIHANG (CN)
ZHONG MENGJIE (CN)
LIU SHAOHUA (CN)
WANG CHONGHUA (CN)
ZHUANG WEIXIONG (CN)
WEN BINGTAI (CN)
LIU HUANTIAN (CN)
YE DONGMENG (CN)
YAO GUOHUAN (CN)
WANG HONGJIE (CN)
LIAO PINGYUAN (CN)
GUO ZHIHANG (CN)
ZHONG MENGJIE (CN)
LIU SHAOHUA (CN)
WANG CHONGHUA (CN)
ZHUANG WEIXIONG (CN)
WEN BINGTAI (CN)
LIU HUANTIAN (CN)
YE DONGMENG (CN)
YAO GUOHUAN (CN)
WANG HONGJIE (CN)
Application Number:
PCT/CN2021/073866
Publication Date:
June 02, 2022
Filing Date:
January 27, 2021
Export Citation:
Assignee:
GUANGDONG JIAYUAN TECH CO LTD (CN)
International Classes:
H05K1/09; C25D1/04
Foreign References:
| CN102002737A | 2011-04-06 | |||
| CN101935856A | 2011-01-05 | |||
| CN102618902A | 2012-08-01 | |||
| US20030148136A1 | 2003-08-07 |
Attorney, Agent or Firm:
BEIJING DONGFANG SHENGFAN IP AGENT FIRM GP (CN)
Download PDF: