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Patent Searching and Data


Title:
LIQUID PHASE DIFFUSION BONDING PIPE JOINT AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2010/024261
Kind Code:
A1
Abstract:
Disclosed is a liquid phase diffusion bonding pipe joint, which liquid-phase diffusion bonds metal pipes or a metal pipe and a pipe union, and a manufacturing method for same. The liquid phase diffusion bonding pipe joint is characterized by comprising: a sloping part, which is press-fitted to the end part of a metal pipe by means of compressive force in the axial direction of the pipe and expands the inner diameter of the metal pipe and tightly engages the end part; a metal joint equipped with a joint surface part that continues from the sloping part and is connected to the end face of the metal pipe with a liquid phase diffusion bond; and the metal pipe, the diameter of which is expanded at the end part while the end part tightly engages with the sloping part, and wherein the end face is connected to the joint surface part with a liquid phase diffusion bond.

Inventors:
TSURU EIJI (JP)
HASEGAWA YASUSHI (JP)
SHINOHARA YASUHIRO (JP)
SATO YUICHI (JP)
Application Number:
PCT/JP2009/064812
Publication Date:
March 04, 2010
Filing Date:
August 19, 2009
Export Citation:
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Assignee:
NIPPON STEEL CORP (JP)
TSURU EIJI (JP)
HASEGAWA YASUSHI (JP)
SHINOHARA YASUHIRO (JP)
SATO YUICHI (JP)
International Classes:
B23K20/00; F16L13/00
Foreign References:
JPH1085954A1998-04-07
JPH1058162A1998-03-03
JPH0985467A1997-03-31
JPH09182979A1997-07-15
JPH1085954A1998-04-07
JP2001340974A2001-12-11
JP2001330594A2001-11-30
Other References:
See also references of EP 2332686A4
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
Atsushi Aoki (JP)
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