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Patent Searching and Data


Title:
LEAK SENSOR MODULE
Document Type and Number:
WIPO Patent Application WO/2023/249417
Kind Code:
A1
Abstract:
The present invention relates to a leak sensor module, comprising: a sensor-mounting kit partially surrounding and interconnecting flanges of a measuring instrument and a pipe connected thereto and/or flanges of a pair of pipes connected to each other; a leak sensor arranged on the sensor-mounting kit to be in contact with the flanges of the measuring instrument and the pipe connected thereto and/or the flanges of the pair of pipes connected to each other, and to detect a leak in the pipe(s) on the basis of vibrational sound waves transmitted from the sensor-mounting kit; and fastening means for fastening the sensor-mounting kit to each of the flanges.

Inventors:
NA KWANG YUN (KR)
Application Number:
PCT/KR2023/008638
Publication Date:
December 28, 2023
Filing Date:
June 21, 2023
Export Citation:
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Assignee:
SC SOLUTION GLOBAL CO LTD (KR)
International Classes:
G01D11/30; F16L23/02; G01D11/24; G01D21/02; G01F15/06; G01F15/14; G01F15/18; G01M3/24
Foreign References:
KR101406507B12014-06-11
KR101696675B12017-01-19
KR20180097862A2018-09-03
JPH11325352A1999-11-26
US5170659A1992-12-15
Attorney, Agent or Firm:
BLT PATENT & LAW FIRM (KR)
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