Title:
LEAD-FREE SOLDER ALLOY, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2012/077228
Kind Code:
A1
Abstract:
The purpose of the present invention is to obtain a lead-free solder alloy with high connection reliability for power cycles in semiconductor devices that operate at high temperatures and a semiconductor device using the same.
The composition for the lead-free solder alloy was optimized so as to contain 5 - 15% by mass antimony (Sb), 0.5 - 3% by mass copper (Cu) 0.01 - 0.15% by mass nickel (Ni), and 0.1 - 5% by mass indium (In), with the remainder being formed from tin (Sn) and inevitable impurities.
Inventors:
YAMAZAKI KOJI (JP)
KUSUNOKI TAKU (JP)
YAMADA AKIRA (JP)
OHTSU KENJI (JP)
KUSUNOKI TAKU (JP)
YAMADA AKIRA (JP)
OHTSU KENJI (JP)
Application Number:
PCT/JP2010/072234
Publication Date:
June 14, 2012
Filing Date:
December 10, 2010
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
YAMAZAKI KOJI (JP)
KUSUNOKI TAKU (JP)
YAMADA AKIRA (JP)
OHTSU KENJI (JP)
YAMAZAKI KOJI (JP)
KUSUNOKI TAKU (JP)
YAMADA AKIRA (JP)
OHTSU KENJI (JP)
International Classes:
B23K35/26; C22C13/02; H01L21/52
Domestic Patent References:
| WO2010047139A1 | 2010-04-29 |
Foreign References:
| JP2009070863A | 2009-04-02 | |||
| JP2004298931A | 2004-10-28 | |||
| JP2001284792A | 2001-10-12 | |||
| JP2008221330A | 2008-09-25 | |||
| JP2006159265A | 2006-06-22 | |||
| JP2004106027A | 2004-04-08 |
Attorney, Agent or Firm:
OIWA Masuo et al. (JP)
Masuo Oiwa (JP)
Masuo Oiwa (JP)
Download PDF:
Claims:
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