Title:
LAMINATE
Document Type and Number:
WIPO Patent Application WO/2024/052768
Kind Code:
A1
Abstract:
The present invention pertains to a laminate that can achieve adhesiveness with respect to a copper foil, and also heat resistance and electrical properties. More specifically, the present invention provides a laminate which comprises a copper foil having a Rz of 1.2 μm or less in the surface and a primer layer laminated on the surface of the copper foil, and in which the primer layer is formed by including a styryl group-containing silane coupling agent or a styrene-based elastomer having a styrene content of 30-90 mass%.
Inventors:
YAGI AZUSA (JP)
TAKEI KUNIHIRO (JP)
TAKEI KUNIHIRO (JP)
Application Number:
PCT/IB2023/058607
Publication Date:
March 14, 2024
Filing Date:
August 31, 2023
Export Citation:
Assignee:
FUJIMORI KOGYO CO (JP)
International Classes:
B32B15/08; B32B15/088; H05K1/03
Foreign References:
| JP2017197597A | 2017-11-02 | |||
| JP2019172803A | 2019-10-10 | |||
| JP2006289959A | 2006-10-26 | |||
| JP2005053218A | 2005-03-03 | |||
| JP2017047686A | 2017-03-09 | |||
| JP2005105061A | 2005-04-21 |
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