LAMINATE, METHOD FOR PRODUCING LAMINATE, AND METHOD FOR PRODUCING CONNECTION STRUCTURE

Title:

LAMINATE, METHOD FOR PRODUCING LAMINATE, AND METHOD FOR PRODUCING CONNECTION STRUCTURE

Document Type and Number:

WIPO Patent Application WO/2023/214522

Kind Code:

A1

Abstract:

A laminate 1 comprising a first base material 2, an adhesive film 3 for circuit connection provided on the first base material 2, and a second base material 4 provided on the adhesive film 3, where, when the adhesive strength of the first base material 2 to the adhesive film 3 is taken as P1 and the adhesive strength of the second base material 4 to the adhesive film 3 is taken as P2, P1/P2 is 0.25-0.80.

Inventors:

YAMAZAKI YUTA (JP)
TOMISAKA KATSUHIKO (JP)
ICHIMURA TAKAYUKI (JP)
TAKAYAMA TOMOKI (JP)

Application Number:

PCT/JP2023/016140

Publication Date:

November 09, 2023

Filing Date:

April 24, 2023

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Assignee:

RESONAC CORP (JP)

International Classes:

B32B27/00; C09J7/30; C09J7/40; C09J9/02; C09J11/04; C09J201/00; H01R11/01

Foreign References:

JP2008115241A	2008-05-22
JP2012023025A	2012-02-02
JP2013209495A	2013-10-10

Attorney, Agent or Firm:

HASEGAWA Yoshiki et al. (JP)

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