Title:
LAMINATE, AND METHOD FOR MANUFACTURING CORELESS SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2024/043196
Kind Code:
A1
Abstract:
This laminate (10) has a core resin layer (11), a first metal layer (12) provided on at least one surface side of the core resin layer (11) and provided with a peeling means, a diffusion prevention layer (13) provided on the surface of the first metal layer (12) on the opposite side to the core resin layer (11), and a plating resist (14) provided on the surface of the diffusion prevention layer (13) on the opposite side to the first metal layer (12). A protective plating layer (15) is provided on the side of the diffusion prevention layer (13) opposite to the first metal layer (12), in regions where the plating resist (14) is not provided.
Inventors:
KITAMURA SHINYA (JP)
KAWASHITA KAZUAKI (JP)
NAKAGAWA HAYATO (JP)
NOHARA KIMIYUKI (JP)
NOBUKUNI TAKESHI (JP)
KAWASHITA KAZUAKI (JP)
NAKAGAWA HAYATO (JP)
NOHARA KIMIYUKI (JP)
NOBUKUNI TAKESHI (JP)
Application Number:
PCT/JP2023/029908
Publication Date:
February 29, 2024
Filing Date:
August 18, 2023
Export Citation:
Assignee:
MGC ELECTROTECHNO CO LTD (JP)
YONEZAWA DIA ELECTRONICS CO INC (JP)
YONEZAWA DIA ELECTRONICS CO INC (JP)
International Classes:
H05K3/46; B32B15/08
Domestic Patent References:
| WO2015122258A1 | 2015-08-20 | |||
| WO2002024444A1 | 2002-03-28 |
Foreign References:
| JP2018092975A | 2018-06-14 | |||
| JP2014063950A | 2014-04-10 |
Attorney, Agent or Firm:
FUJIKI Hiroshi et al. (JP)
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