Title:
LAMINATE, METAL-CLAD LAMINATE, AND WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2024/070619
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a laminate that has excellent level difference conformability and excellent adhesion when the laminate is bonded to an object having a level difference by thermocompression. The present invention also addresses the problem of providing a metal-clad laminate and a wiring board. A laminate according to the present invention comprises an A layer, a B layer, and a C layer in this order, wherein: the A layer contains at least one polymer selected from the group consisting of liquid crystal polymers, polyimides, modified polyimides, fluororesins, modified fluororesins, polyetherimides, polyetheretherketones, polyethersulfones, polysulfones, polyphenylene sulfides, polycycloolefins, and modified polycycloolefins; the ratio of the elastic modulus of the B layer at 160°C to the elastic modulus of the A layer at 160°C is not more than 0.1; and the C layer contains a thermosetting compound.
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Inventors:
SAWAYA TAKEAKI (JP)
KIDO TAKEO (JP)
KONO SHUTO (JP)
KIDO TAKEO (JP)
KONO SHUTO (JP)
Application Number:
PCT/JP2023/032992
Publication Date:
April 04, 2024
Filing Date:
September 11, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
B32B27/36; B32B7/022; B32B15/08; B32B15/09; H05K1/03
Domestic Patent References:
| WO2022113964A1 | 2022-06-02 | |||
| WO2022163776A1 | 2022-08-04 | |||
| WO2022071525A1 | 2022-04-07 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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