Title:
LAMINATE, FILM, THERMOSETTING FILM, AND METHOD FOR PRODUCING WIRING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2024/048727
Kind Code:
A1
Abstract:
Provided are: a laminate comprising a layer A, a layer B that is on at least one surface of the layer A, and a conductive pattern that contacts at least part of the layer B, wherein the dielectric loss tangent at 28 GHz is not more than 0.01, and a value obtained subtracting the remaining mass rate of the layer B at 900°C from the remaining mass rate of the layer B at 440°C is not less than 40 mass%; a film comprising a layer A and a layer B that is on at least one surface of the layer A, wherein the dielectric loss tangent at 28 GHz is not more than 0.01, the elastic modulus of the layer B at 160°C is not more than 0.5 MPa, and the layer B contains a thermosetting resin; a thermosetting film; and method for producing a wiring substrate using the film and the thermosetting film.
Inventors:
HAYASHI DAISUKE (JP)
TAKAHASHI KEITA (JP)
TAKAHASHI KEITA (JP)
Application Number:
PCT/JP2023/031833
Publication Date:
March 07, 2024
Filing Date:
August 31, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
B32B15/08; C08K3/013; C08L101/00; H05K3/28
Domestic Patent References:
| WO2022163776A1 | 2022-08-04 | |||
| WO2016117554A1 | 2016-07-28 | |||
| WO2006059750A1 | 2006-06-08 | |||
| WO2021112087A1 | 2021-06-10 | |||
| WO2022138665A1 | 2022-06-30 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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