Title:
IRON-NICKEL ALLOY ELECTROPLATING LIQUID FOR FILLING AND METHOD FOR FILLING OPENING USING SAME, AND METHOD FOR MANUFACTURING CIRCUIT SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2018/186217
Kind Code:
A1
Abstract:
Provided are: an iron-nickel alloy electroplating liquid for filling, characterized in that an acetylene alcohol is furthermore contained in the iron-nickel alloy electroplating liquid; a method for filling an opening using the iron-nickel alloy electroplating liquid for filling; and a technique whereby an iron-nickel alloy can be utilized in circuit formation by electroplating using a method for manufacturing a circuit substrate.
Inventors:
HORI MASAO (JP)
HASHIMOTO YASUO (JP)
HASHIMOTO YASUO (JP)
Application Number:
PCT/JP2018/012072
Publication Date:
October 11, 2018
Filing Date:
March 26, 2018
Export Citation:
Assignee:
JCU CORP (JP)
International Classes:
C25D3/56; C25D7/00; H05K1/11; H05K3/42
Foreign References:
| JPS61147896A | 1986-07-05 | |||
| JP2002208109A | 2002-07-26 | |||
| JP2011168831A | 2011-09-01 | |||
| JP2009052075A | 2009-03-12 |
Attorney, Agent or Firm:
THE PATENT CORPORATE BODY OF ONO & CO. (JP)
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