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Title:
INSERT AND CUTTING TOOL
Document Type and Number:
WIPO Patent Application WO/2023/074277
Kind Code:
A1
Abstract:
An insert (1) of the present disclosure includes: a substrate (2); and a covering layer (3) that covers the surface of the substrate (2). The substrate (2) comprises a cermet. Further, an insert of one embodiment is configured so that an intermediate layer (4), which contains Ti and Ar, is positioned between the substrate (2) and the covering layer (3).

Inventors:
SAKAMOTO YOSHIKI (JP)
MORI SATOSHI (JP)
Application Number:
PCT/JP2022/037118
Publication Date:
May 04, 2023
Filing Date:
October 04, 2022
Export Citation:
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Assignee:
KYOCERA CORP (JP)
International Classes:
B23B27/14; C23C14/06
Domestic Patent References:
WO2018216256A12018-11-29
WO2009119682A12009-10-01
WO2021024736A12021-02-11
WO2015068776A12015-05-14
Foreign References:
US20190161849A12019-05-30
JP2005344148A2005-12-15
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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