INFRARED SENSOR MOUNTING MEMBER - MITSUBISHI MATERIALS CORP

Title:

INFRARED SENSOR MOUNTING MEMBER

Document Type and Number:

WIPO Patent Application WO/2018/128122

Kind Code:

A1

Abstract:

Provided is an infrared sensor mounting member that enables heat inside a cavity that houses heat sensitive elements to be effectively radiated to the outside. This infrared sensor mounting member enables an infrared sensor body 5, in which heat sensitive elements 3A, 3B and a plurality of terminal electrodes 4 are formed on an insulating substrate 2, to be mounted on a mounting substrate by fixing the sensor body to an upper part of the mounting member. The infrared sensor mounting member is equipped with an insulating mounting member body 6 and a plurality of conductive terminal members 7 that are attached to the mounting member body and have upper ends that are connected to the terminal electrodes and lower ends that will be connected to the mounting substrate at the time of mounting. The terminal members are formed of a material having a higher thermal conductivity than the mounting member body and each have a terminal pin part 7a that protrudes laterally. The mounting member body has terminal member hole parts 6a into which the terminal pin parts, which are formed on the side parts, are inserted and fixed in place, and element accommodating hole parts 8 that are formed in an upper part thereof, are disposed directly below the heat sensitive elements, and communicate with the terminal member hole parts.

Inventors:

SHIRATA KEIJI (JP)
HIRANO SHINGO (JP)

Application Number:

PCT/JP2017/046574

Publication Date:

July 12, 2018

Filing Date:

December 26, 2017

Export Citation:

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Assignee:

MITSUBISHI MATERIALS CORP (JP)

International Classes:

G01J1/02; G01J5/02; H01L37/00; H01L37/02

Foreign References:

JP2014071051A	2014-04-21
JP2013238475A	2013-11-28
JPH0886691A	1996-04-02
JPH0374332U	1991-07-25
US20060255274A1	2006-11-16

Other References: