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Patent Searching and Data


Title:
HOUSING PROVIDED WITH MARK PIECE, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/098357
Kind Code:
A1
Abstract:
The present application provides a housing provided with a mark piece, and an electronic device, wherein the housing provided with the mark piece comprises a structural piece, at least one mark piece, and a support plate, the structural piece having an inner surface and an outer surface that are opposite to each other, and at least one through hole running through the structural piece. The at least one through hole and the at least one mark piece are arranged in a one-to-one correspondence mode, and the shape of any through hole in the at least one through hole is matched with the shape of the corresponding mark piece. The support plate is fixed to the inner surface of the structural piece and covers the at least one through hole; the position of the support plate facing any through hole is provided with a protrusion extending towards the interior of the through hole; and the mark piece is embedded into the corresponding through hole from the outer surface of the structural piece and is bonded and fixed to the protrusion in an adhesive dispensing manner. The present invention has the advantages that the bonding firmness of the mark piece is high, an adhesive does not overflow when the mark piece is assembled; meanwhile, the gap between the mark piece and the structural piece is small, and the flatness is high; and the present invention has the advantage of refined appearance.

Inventors:
ZHAO YANGYANG (CN)
DONG XIWANG (CN)
Application Number:
PCT/CN2022/128019
Publication Date:
June 08, 2023
Filing Date:
October 27, 2022
Export Citation:
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Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H05K5/02; G09F3/02; G09F3/10
Foreign References:
CN216960410U2022-07-12
CN102069672A2011-05-25
CN103310705A2013-09-18
US20130225247A12013-08-29
CN212367687U2021-01-15
Attorney, Agent or Firm:
YINKE PATENT & TRADEMARK AGENT (SHANGHAI) LTD. (CN)
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