Title:
HOUSING ASSEMBLY, METHOD FOR MANUFACTURING HOUSING ASSEMBLY, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/259370
Kind Code:
A1
Abstract:
A housing assembly (100), a method for manufacturing the housing assembly (100), and an electronic device (1000) are provided according to the present disclosure. The housing assembly (100) includes a housing body (10) and a flexible film layer (20). The housing body (10) has a bottom portion (11) and at least one side wall (12) connected with an outer edge of the bottom portion (11), and each of the at least one side wall (12) and the bottom portion (11) cooperatively define a bending angle larger than 70 degrees. The flexible film layer (20) is disposed on a first surface (13) of the housing body (10), and the flexible film layer (20) has an elongation at break higher than or equal to 150%.
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Inventors:
BI SIPENG (CN)
YANG GUANGMING (CN)
HOU TIBO (CN)
YANG GUANGMING (CN)
HOU TIBO (CN)
Application Number:
PCT/CN2020/096613
Publication Date:
December 30, 2020
Filing Date:
June 17, 2020
Export Citation:
Assignee:
GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP LTD (CN)
International Classes:
H05K5/02; B32B1/00
Foreign References:
| CN109874253A | 2019-06-11 | |||
| CN209823837U | 2019-12-20 | |||
| CN110177165A | 2019-08-27 | |||
| CN207897243U | 2018-09-21 |
Attorney, Agent or Firm:
SCIHEAD IP LAW FIRM (CN)
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