Title:
HOLLOW PARTICLES
Document Type and Number:
WIPO Patent Application WO/2022/163600
Kind Code:
A1
Abstract:
Provided are hollow particles with a reduced coefficient of thermal expansion. These hollow particles each comprise a shell containing a resin and a hollow section surrounded by the shell, have a porosity of 50% or more, and a volume average particle diameter of 1.0 μm or greater. The shell contains, as the resin, a polymer that contains 70-100 parts by mass of crosslinkable monomeric units per 100 parts by mass of the total monomeric units. The coefficient of thermal expansion of the hollow particles is 10×10-5/°C or less at 80-200°C. When the hollow particles are subjected to an immersion test, in which 0.1 mg of the hollow particles are added to 4 mL of acetone, such mixture is shook for 10 minutes under at a shaking speed of 100 rpm, and the mixture is left to stand for 48 hours, the amount of the hollow particles that settle in the acetone is less than 10 mass%.
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Inventors:
WATANABE MASASHI (JP)
Application Number:
PCT/JP2022/002494
Publication Date:
August 04, 2022
Filing Date:
January 25, 2022
Export Citation:
Assignee:
ZEON CORP (JP)
International Classes:
C08F8/00; B01J13/20; C08F2/18; C08F2/44; C08J9/32
Foreign References:
| JP2020132820A | 2020-08-31 | |||
| JP2017165890A | 2017-09-21 | |||
| JP2020033503A | 2020-03-05 | |||
| JP2020183500A | 2020-11-12 | |||
| JP2008266504A | 2008-11-06 | |||
| JP2007048615A | 2007-02-22 |
Other References:
"Kagaku Binran, Kiso Hen, Kaitei 4 Ban", 30 September 1993, MARUZEN PUBLISHING CO., LTD, pages: 498 - 503
Attorney, Agent or Firm:
KISHIMOTO, Tatsuhito et al. (JP)
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