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Title:
HIGH-TEMPERATURE HIGH-PRESSURE PROCESSING DEVICE USING LIQUID MEDIUM PRESSURIZATION
Document Type and Number:
WIPO Patent Application WO/2022/249893
Kind Code:
A1
Abstract:
[Problem] To provide a hydrostatic pressure-type high-temperature high-pressure processing device using a wet process and a dry process, for efficiently mass-producing large-sized synthetic diamonds of high quality. [Solution] This processing device stores a high-pressure cell that prevents the internal intrusion of a pressure medium into a high-pressure vessel and performs hydrostatic pressurizing with the pressure medium, which is in liquid form. The processing device has at least one pressurizing mechanism 10 for a pressure medium 6 that can be used first and is attached to the processing device, and a pressure medium, for which the compression rate and volume change rate are already known, is used. The processing device is provided with a means for heating the pressure medium and a means for measuring the average temperature in the vertical direction. The pressure medium is heated to a predetermined temperature to cause thermal expansion, and the process is continued while maintaining the pressure even after the pressurizing mechanism has stopped. The processing device can perform a high-temperature high-pressure process on two or more of the high-pressure cells 9 at the same time under uniform pressure with no directionality. 11. Check valve, 22. Thermocouple, 27. Cooling jacket, 30. Pressure medium heating heater, 31. Partition plate, 65. Copper plate

Inventors:
WADA RYUTARO (JP)
Application Number:
PCT/JP2022/020084
Publication Date:
December 01, 2022
Filing Date:
May 12, 2022
Export Citation:
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Assignee:
WADA RYUTARO (JP)
International Classes:
B01J3/06; B30B5/02; F27B17/00
Foreign References:
US20050150444A12005-07-14
JPS4613430B11971-04-09
US3529324A1970-09-22
JP2021004692A2021-01-14
JPS60151096U1985-10-07
JP2008546528A2008-12-25
JPS6384796A1988-04-15
JP2012187612A2012-10-04
CN109289704A2019-02-01
JP2010117076A2010-05-27
JP2020185595A2020-11-19
JP7052969B12022-04-12
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