Title:
HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/113763
Kind Code:
A1
Abstract:
This high-frequency module (1) comprises: a first substrate (71), on which a low-noise amplification circuit (21) is formed, and which is configured at least in part from a first semiconductor material; a second substrate (72), on which a power amplification circuit (11) is formed and which is configured at least in part from a second semiconductor material having a lower thermal conductivity than the first semiconductor material; and a module board (90) having a principal surface (90a) on which the first substrate (71) and the second substrate (72) are arranged. The first substrate (71) is joined to the principal surface (90a) via an electrode (717), and the second substrate (72) is arranged between the module board (90) and the first substrate (71) in a cross-sectional view and is joined to the principal surface (90a) via an electrode (724). At least a portion of the first substrate (71) overlaps at least a portion of the second substrate (72) in plan view.
Inventors:
TSUDA MOTOJI (JP)
YAMAGUCHI YUKIYA (JP)
UEJIMA TAKANORI (JP)
YAMAGUCHI YUKIYA (JP)
UEJIMA TAKANORI (JP)
Application Number:
PCT/JP2021/041623
Publication Date:
June 02, 2022
Filing Date:
November 11, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H04B1/38
Domestic Patent References:
| WO2020179504A1 | 2020-09-10 | |||
| WO2019054154A1 | 2019-03-21 | |||
| WO2018123699A1 | 2018-07-05 |
Foreign References:
| JP2020102693A | 2020-07-02 |
Attorney, Agent or Firm:
YOSHIKAWA, Shuichi et al. (JP)
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