Title:
HEATING DEVICE AND TEMPERATURE MEASUREMENT METHOD USING SAID HEATING DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/101342
Kind Code:
A1
Abstract:
The present invention provides a heating device in which a temperature sensor can be disposed near a light-emitting semiconductor chip that is a heating source. The heating device 10 is constituted of a heating semiconductor chip 14 that emits heating light L onto a heating target X, a temperature sensor 16 that measures the temperature of the heating target X heated by the light L, and a cooling device 18 that cools the heating semiconductor chip 14 and the temperature sensor 16.
Inventors:
GOUDA TETSUYA (JP)
Application Number:
PCT/JP2023/040011
Publication Date:
May 16, 2024
Filing Date:
November 07, 2023
Export Citation:
Assignee:
PHOENIX ELECTRIC CO LTD (JP)
International Classes:
H01L21/26; G01J5/00; H01L21/02
Foreign References:
| JP2017509143A | 2017-03-30 | |||
| JP2020057761A | 2020-04-09 | |||
| JP2003297123A | 2003-10-17 | |||
| JP2003106901A | 2003-04-09 |
Attorney, Agent or Firm:
TADA Yuji (JP)
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