Title:
HEATING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2006/062086
Kind Code:
A1
Abstract:
A heating apparatus which can increase the temperature of a heating element to a target temperature in a short time and ensures temperature uniformity of the heating element. In the heating apparatus, when the specific resistance of a material of a heat generating layer (212) of a heating roller (210) is &rgr (µ&ohm cm), the average thickness of the heat generating layer (212) is 5&rgr (µm) or more but not more than 15&rgr (µm), and the thickness error is 1.2&rgr (µm) or less. For instance, in the case of forming the heat generating layer (212) by using cupper having a specific resistance of 1.7(µ&ohm cm), the average thickness of the heat generating layer (212) is 8-25(µm), and the thickness error is 2(µm) or less. Thus, the heating roller (210) having a short heat increasing time and excellent temperature uniformity is provided.
Inventors:
YASUDA AKIHIRO
KATAKABE NOBORU
SAMEI MASAHIRO
KATAKABE NOBORU
SAMEI MASAHIRO
Application Number:
PCT/JP2005/022352
Publication Date:
June 15, 2006
Filing Date:
December 06, 2005
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD (JP)
YASUDA AKIHIRO
KATAKABE NOBORU
SAMEI MASAHIRO
YASUDA AKIHIRO
KATAKABE NOBORU
SAMEI MASAHIRO
International Classes:
H05B6/02; F16C13/00; G03G15/20; H05B6/14
Domestic Patent References:
WO2003043379A1 | 2003-05-22 |
Foreign References:
JP2001176648A | 2001-06-29 | |||
JPH0830126A | 1996-02-02 | |||
JP2004226822A | 2004-08-12 | |||
JP2002260836A | 2002-09-13 | |||
JP2004133370A | 2004-04-30 | |||
JP2001188427A | 2001-07-10 | |||
JP2004341164A | 2004-12-02 | |||
JPH10208859A | 1998-08-07 | |||
JP2003215958A | 2003-07-30 |
Attorney, Agent or Firm:
Washida, Kimihito (Shintoshicenter Bldg. 24-1, Tsurumaki 1-chom, Tama-shi Tokyo 34, JP)
Download PDF: