Title:
HEATER UNIT, MULTILAYER STRUCTURE, PROCESSING DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/145054
Kind Code:
A1
Abstract:
The present invention improves energy conservation of a device. This heater unit comprises a thermal insulation portion including a heating portion that heats the inside of a reaction tube, and a multilayer portion provided outside the thermal insulation portion and having an internal space. The multilayer portion includes a plurality of heat insulators along a direction from the thermal insulation portion toward the outside, and a space is formed between the heat insulators. The heater unit is configured such that the amount of heat emitted from the multilayer portion can be changed in accordance with the heat conductivity in the space and the thermal emittance of the heat insulators.
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Inventors:
SAIDO SHUHEI (JP)
Application Number:
PCT/JP2022/003545
Publication Date:
August 03, 2023
Filing Date:
January 31, 2022
Export Citation:
Assignee:
KOKUSAI ELECTRIC CORP (JP)
International Classes:
H01L21/324
Foreign References:
| JP2004214283A | 2004-07-29 | |||
| JP2011029597A | 2011-02-10 | |||
| JP2000048857A | 2000-02-18 | |||
| JP2000008167A | 2000-01-11 | |||
| JP2009182295A | 2009-08-13 | |||
| JPH0674391A | 1994-03-15 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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