HEAT TRANSFER DEVICE - TOSHIBA MITSUBISHI ELEC INC

Title:

HEAT TRANSFER DEVICE

Document Type and Number:

WIPO Patent Application WO/2013/161013

Kind Code:

A1

Abstract:

Provided is a heat transfer device whereby temperature uniformity can be enhanced throughout the entire length of a piping system housed in the heat transfer device. A heat transfer device (20) for transferring heat to a piping system (10) inside which a fluid flows is provided with a heat transfer block (30) having high thermal conductivity enclosing the piping system (10), a heat pipe (40) formed in the heat transfer block (30) in the extension direction of the piping system (10), and a heater (52) for adding heat to the heat pipe (40), the heat transfer block (30) including a plurality of divided blocks divisible along the extension direction of the piping system (10), and being provided with approaching parts (36) at which the heat transfer block (30) and the piping system (10) approach each other at both end parts of the heat transfer block (30) in the extension direction of the piping system (10).

Inventors:

UNO JUNICHI (JP)
YAMAKAGE HISAAKI (JP)

Application Number:

PCT/JP2012/061023

Publication Date:

October 31, 2013

Filing Date:

April 25, 2012

Export Citation:

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Assignee:

TOSHIBA MITSUBISHI ELEC INC (JP)
UNO JUNICHI (JP)
YAMAKAGE HISAAKI (JP)

International Classes:

F16L53/30; F24H1/12; F28D15/02

Domestic Patent References:

WO2011055430A1	2011-05-12
WO2010032304A1	2010-03-25

Foreign References:

JP2005214403A	2005-08-11
JP2009521651A	2009-06-04
JP2007002986A	2007-01-11
US4017102A	1977-04-12

Attorney, Agent or Firm:

Fukami Patent Office, p. c. (JP)
Patent business corporation Fukami patent firm (JP)

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