Title:
HEAT SEAL SHEET AND STERILIZED PACKAGE
Document Type and Number:
WIPO Patent Application WO/2024/075655
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: an excellent heat seal sheet that has sufficient heat adhesiveness and air permeability throughout the whole heat seal surface thereof, and that has a high strength and a reduced amount of lint generated therefrom; a production method for the heat seal sheet; and a sterilized package using the heat seal sheet. The heat seal sheet according to the present invention comprises: one or more thermoplastic resin fiber nonwoven fabric layers A; and one or more thermoplastic resin fiber nonwoven fabric layers B. The thermoplastic resin fiber nonwoven fabric layers B each contain a low-melting-point polyester resin, polyester fibers, and a polyethylene resin. The mass ratio of the low-melting-point polyester resin, the polyester fibers, and the polyethylene resin (low-melting-point polyester resin : polyester fibers : polyethylene resin) is 13.75:11.25:75 to 41.25:33.75:25. The Oken-type air permeability of the heat seal sheet as measured in accordance with JIS P 8117:2009 is at most 700 seconds, and the tear strength of the heat seal sheet as measured in accordance with JIS P 8116:2000 is at least 700 mN.
Inventors:
MANDO RITSUO (JP)
KOGUCHI YUKIKO (JP)
KAWAKITA MASAHIRO (JP)
NAGOYA MISA (JP)
YANAGISAWA KENJI (JP)
KOGUCHI YUKIKO (JP)
KAWAKITA MASAHIRO (JP)
NAGOYA MISA (JP)
YANAGISAWA KENJI (JP)
Application Number:
PCT/JP2023/035722
Publication Date:
April 11, 2024
Filing Date:
September 29, 2023
Export Citation:
Assignee:
OJI HOLDINGS CORP (JP)
International Classes:
B32B5/26; A61B50/00; B32B27/32; B32B27/36; B65D65/40; A61L2/04; A61L2/08; A61L2/20; B65B55/08
Domestic Patent References:
WO2019107025A1 | 2019-06-06 |
Foreign References:
JP2022068392A | 2022-05-10 | |||
JPH0483634A | 1992-03-17 | |||
JP2019183293A | 2019-10-24 | |||
JP2019206351A | 2019-12-05 | |||
JP2017002439A | 2017-01-05 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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