Title:
HEAT REFLECTIVE SUBSTRATE, MANUFACTURING METHOD THEREFOR, AND WINDOW GLASS
Document Type and Number:
WIPO Patent Application WO/2024/014417
Kind Code:
A1
Abstract:
The present invention relates to a heat reflective substrate that comprises a dielectric substrate and a heat reflective film on at least one principal surface of the dielectric substrate, and has a radio wave transmissive region on at least part of the at least one principal surface in plan view, wherein the radio wave transmissive region is provided with a slit portion where the heat reflective film is not present, and in the radio wave transmissive region, a solar radiation heat acquisition rate (g0) obtained by a predetermined method in a region not including the slit portion, and a solar radiation heat acquisition rate (g1) in a region including the slit portion satisfy a specific relationship.
Inventors:
UMEDA KENICHI (JP)
ARAI KEISUKE (JP)
KISHI MASAHIRO (JP)
ARAI KEISUKE (JP)
KISHI MASAHIRO (JP)
Application Number:
PCT/JP2023/025362
Publication Date:
January 18, 2024
Filing Date:
July 07, 2023
Export Citation:
Assignee:
AGC INC (JP)
International Classes:
G02B5/26; B32B3/14; B32B7/027; B60J1/00; C03C17/09; C03C17/245; H01Q15/14
Domestic Patent References:
| WO2018012252A1 | 2018-01-18 | |||
| WO2015025963A1 | 2015-02-26 |
Foreign References:
| JP2018205615A | 2018-12-27 | |||
| JP2017181911A | 2017-10-05 | |||
| JP2010243981A | 2010-10-28 |
Attorney, Agent or Firm:
EIKOH, P.C. (JP)
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