Title:
HEAT DISSIPATION DEVICE AND HEAT DISSIPATION SYSTEM
Document Type and Number:
WIPO Patent Application WO/2022/246637
Kind Code:
A1
Abstract:
A heat dissipation device for supplying a liquid to a heat source (S1). The heat dissipation device comprises a liquid distribution cavity (11) and a heat dissipation cavity (12) which are in communication with each other by means of a plurality of jet holes (14h), wherein the liquid distribution cavity (11) is provided with a liquid inlet (10a); a heat source (S1) is at least partially accommodated in the heat dissipation cavity (12); the liquid distribution cavity (11) comprises at least two sub-cavities; a liquid flows through the sub-cavities in sequence and then enters the heat dissipation cavity (12); and in the flowing path of the liquid, two adjacent sub-cavities are in communication with each other by means of a plurality of liquid distribution holes (11h). A heat dissipation system is further provided in the present application.
Inventors:
CHEN JINYU (CN)
LU JIANBIAO (CN)
SU YU (CN)
ZHU LONGGUANG (CN)
CHEN XIAODAN (CN)
ZHENG JIANTAO (CN)
LU JIANBIAO (CN)
SU YU (CN)
ZHU LONGGUANG (CN)
CHEN XIAODAN (CN)
ZHENG JIANTAO (CN)
Application Number:
PCT/CN2021/095729
Publication Date:
December 01, 2022
Filing Date:
May 25, 2021
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H05K7/20
Foreign References:
| CN109637987A | 2019-04-16 | |||
| CN111356343A | 2020-06-30 | |||
| CN101080160A | 2007-11-28 | |||
| CN109755199A | 2019-05-14 | |||
| US5239443A | 1993-08-24 |
Attorney, Agent or Firm:
BEIJING GLOBAL INTELLECTUAL PROPERTY LAW FIRM (CN)
Download PDF:
Previous Patent: METHOD AND APPARATUS FOR POWER SAVING IN SEMICONDUCTOR DEVICES
Next Patent: M-TYPE HIDDEN CONNECTING PIECE
Next Patent: M-TYPE HIDDEN CONNECTING PIECE