Title:
HEADPHONE AND WEARABLE DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/113270
Kind Code:
A1
Abstract:
The headphone according to various embodiments may comprise a headband, a first earpiece connected to one end of the headband, and a second earpiece connected to the other end of the headband, the first earpiece comprising: a first plate connected to one end of the headband; a first housing disposed on one surface of the first plate; a first ear pad that may be aligned along a first direction in which the first plate and the first housing are arranged, in parallel therewith, and is disposed to be in contact with the first housing; and a first pressure unit disposed between the first ear pad and the first housing, wherein the first pressure unit may comprise at least a first pressure plate and first pressure pins, which may be disposed between the first pressure plate and the first housing and at least portions of which are non-restrictively accommodated inside the first pressure plate, and the first pressure plate is tiltable with respect to the first housing.
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Inventors:
KIM JINWOOK (KR)
Application Number:
PCT/KR2022/018373
Publication Date:
June 22, 2023
Filing Date:
November 21, 2022
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H04R1/10; H04R5/033
Foreign References:
| JP2008283281A | 2008-11-20 | |||
| JP2001197582A | 2001-07-19 | |||
| JP2008193609A | 2008-08-21 | |||
| JP2012147139A | 2012-08-02 | |||
| US20200045158A1 | 2020-02-06 |
Attorney, Agent or Firm:
MUHANN PATENT & LAW FIRM (KR)
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