Title:
HARD GOLD PLATING SOLUTION
Document Type and Number:
WIPO Patent Application WO/2017/175428
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a hard gold plating solution by which deposition of gold at unwanted locations can be reliably suppressed. Provided is a hard gold plating solution which is for electroplating and which contains a gold ion supply material, an electrically conductive salt, a complexing agent, a metal salt that contains an element that alloys with gold, and a gold deposition-controlling agent. The hard gold plating solution is characterized in that the gold ion supply material is contained at a quantity of 0.5-14 g/L in terms of gold, the specific gravity of the solution is 2-16 ºBe' at a solution temperature of 25ºC, and the electrical conductivity is 10-70 mS/cm at a solution temperature of 25ºC.
Inventors:
MURAKAMI YOSHINORI (JP)
TERASHIMA HAJIME (JP)
WATANABE HIDETO (JP)
TERASHIMA HAJIME (JP)
WATANABE HIDETO (JP)
Application Number:
PCT/JP2016/088430
Publication Date:
October 12, 2017
Filing Date:
December 22, 2016
Export Citation:
Assignee:
KOJIMA CHEMICALS CO LTD (JP)
International Classes:
C25D3/62
Foreign References:
| JP5025815B1 | 2012-09-12 | |||
| US4795534A | 1989-01-03 | |||
| JPS58110687A | 1983-07-01 | |||
| JP2009263776A | 2009-11-12 | |||
| JPS4643441B |
Attorney, Agent or Firm:
YOSHIMURA, Katsuhiro (JP)
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