Title:
GRANULE TREATMENT METHOD AND TREATMENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/043177
Kind Code:
A1
Abstract:
Provided are a granule treatment method and treatment device capable of stably granulating granules that are uniformly dried to a desired level and that have a desired granule size, by supplying heated seed granules to a granulation process (gr) to improve the uniformity of the temperature in a granulation device (GR). The present invention includes a granule treatment method including: a seed granule adjustment step (sc) for forming a fluidized bed of seed granules and preheating the seed granules in the fluidized bed by supplying, from below, a preheating gas via a line 16 to the seed granules; and a granulation step (gr) for supplying, via a line 1, the seed granules heated in the seed granule adjustment step (sc), and granulating same by coating, under a high temperature environment, the surface of the seed granules with a coating substance. The present invention also includes a seed granule adjustment device (SC) and a granulation device (GR), or a seed granule adjustment/granulation device (SC/GR), for carrying out the foregoing steps.
Inventors:
SANO KEIJI (JP)
MINATO TAKUHIRO (JP)
MINATO TAKUHIRO (JP)
Application Number:
PCT/JP2023/029778
Publication Date:
February 29, 2024
Filing Date:
August 18, 2023
Export Citation:
Assignee:
TOYO ENGINEERING CORP (JP)
International Classes:
B01J2/16; B01J8/24
Foreign References:
| JPH07500079A | 1995-01-05 | |||
| JP2022072881A | 2022-05-17 |
Attorney, Agent or Firm:
FURUYA Satoshi (JP)
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