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Patent Searching and Data


Title:
GRANULATED POWDER AND METHOD FOR MANUFACTURING GRANULATED POWDER
Document Type and Number:
WIPO Patent Application WO/2016/199576
Kind Code:
A1
Abstract:
Provided is a granulated powder provided with a plurality of metal grains, a binding resin for binding the plurality of metal grains, and a thickener that is included in the binding resin and that increases the viscosity of the binding resin.

Inventors:
ISHIMINE TOMOYUKI (JP)
Application Number:
PCT/JP2016/065457
Publication Date:
December 15, 2016
Filing Date:
May 25, 2016
Export Citation:
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Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO ELECTRIC SINTERED ALLOY LTD (JP)
International Classes:
B01J2/14; B01J2/28; B22F1/00; B22F1/054; B22F1/10; B22F1/16; H01F1/26; H01F41/02; B22F1/103
Domestic Patent References:
WO2012057153A12012-05-03
Foreign References:
JPH08120393A1996-05-14
JPH08107034A1996-04-23
JP2011179051A2011-09-15
JP2014033001A2014-02-20
JP2011035005A2011-02-17
JP2004115883A2004-04-15
JP2002275501A2002-09-25
JPH03142906A1991-06-18
Other References:
See also references of EP 3305443A4
Attorney, Agent or Firm:
NAKATA, Motomi et al. (JP)
Nakada Motoki (JP)
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