Title:
GOLD PASTE SUITABLE FOR DIP COATING AND DIP COATING METHOD USING SAID GOLD PASTE
Document Type and Number:
WIPO Patent Application WO/2023/145702
Kind Code:
A1
Abstract:
The present invention relates to a gold paste for dip coating a gold film onto an appropriate member to be coated. The gold paste of the present invention has a purity of 99.9 mass% or greater and comprises gold powder of 0.1-0.5 μm in average particle size, and an organic solvent. The present invention adopts an organic solvent in which the distance Ra between Hansen solubility parameters for the metal powder is 7.0 MPa1/2 or more, and the intrinsic viscosity as measured using a rotational viscometer at a shearing rate of 4/s at 25°C is 1.5-6.5 mPa•s. The gold paste according to the present invention has favorable coating properties for dip coating and limits angular protrusions and film thickness unevenness of the member to be coated when the same is drawn up. Additionally, according to the present invention, the surface roughness of the gold paste in the dip tank is reduced.
Inventors:
INOUE KENICHI (JP)
SAITO FUMIHIKO (JP)
SASAKI YUYA (JP)
YOKOKAWA SAORI (JP)
AIZAWA YUSUKE (JP)
SAITO FUMIHIKO (JP)
SASAKI YUYA (JP)
YOKOKAWA SAORI (JP)
AIZAWA YUSUKE (JP)
Application Number:
PCT/JP2023/001997
Publication Date:
August 03, 2023
Filing Date:
January 24, 2023
Export Citation:
Assignee:
TANAKA PRECIOUS METAL IND (JP)
International Classes:
H01B1/22; B22F1/00; B22F1/10; B22F9/00; B22F9/24; H01B13/00
Foreign References:
| JP2013072091A | 2013-04-22 | |||
| JP2005263943A | 2005-09-29 |
Attorney, Agent or Firm:
ORIGINATE IP (JP)
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