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Patent Searching and Data


Title:
FRICTION MATERIAL
Document Type and Number:
WIPO Patent Application WO/2024/010054
Kind Code:
A1
Abstract:
The present invention pertains to a friction material comprising a friction adjusting material, a binding material, and a fiber base material. The friction material contains inorganic particles having an average particle diameter of 15-60 µm and a Mohs hardness of six or higher, while not containing inorganic particles having an average particle diameter of 3 µm or less and a Mohs hardness of six or higher. The friction material also contains titanate having an average particle diameter of 20 µm or higher, and does not contain a copper component.

Inventors:
CHIKADA KATSUTOSHI (JP)
KURIHARA HARUKA (JP)
Application Number:
PCT/JP2023/025047
Publication Date:
January 11, 2024
Filing Date:
July 05, 2023
Export Citation:
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Assignee:
AKEBONO BRAKE IND (JP)
International Classes:
C09K3/14; F16D69/02
Domestic Patent References:
WO2019074012A12019-04-18
WO2021125144A12021-06-24
Foreign References:
JP2020158568A2020-10-01
JP2012255053A2012-12-27
JP2017002186A2017-01-05
Attorney, Agent or Firm:
EIKOH, P.C. (JP)
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