Title:
FRICTION MATERIAL COMPOSITION, FRICTION MATERIAL USING FRICTION MATERIAL COMPOSITION, AND FRICTION MEMBER
Document Type and Number:
WIPO Patent Application WO/2014/034878
Kind Code:
A1
Abstract:
A friction material composition which contains a binder, an organic filler, an inorganic filler and a fiber base, and wherein: the copper content in the friction material composition is 5% by mass or less in terms of copper element; 3-20% by mass of zirconium oxide having an average particle diameter (D50) of 0.1-4 μm is contained as the inorganic filler; and 2-8% by mass of cashew dust is contained as the organic filler. A friction material using this friction material composition; and a friction member.
The present invention is able to provide: a friction material composition which provides a friction material that contains a small amount of copper and that is suppressed in decrease of the friction coefficient during high-load braking and after thermal history, while being suppressed in increase of friction coefficient after being left to stand at low temperatures; a friction material which uses this friction material composition; and a friction member.
Inventors:
MITSUMOTO MASAMICHI (JP)
UNNO MITSUO (JP)
UNNO MITSUO (JP)
Application Number:
PCT/JP2013/073377
Publication Date:
March 06, 2014
Filing Date:
August 30, 2013
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C09K3/14; F16D69/02
Domestic Patent References:
| WO2012066967A1 | 2012-05-24 | |||
| WO2012066966A1 | 2012-05-24 |
Foreign References:
| JP2012255052A | 2012-12-27 | |||
| JPH05247441A | 1993-09-24 | |||
| JP2002241737A | 2002-08-28 | |||
| JP2007106820A | 2007-04-26 | |||
| JP2009298847A | 2009-12-24 | |||
| JPS6220581A | 1987-01-29 |
Attorney, Agent or Firm:
OHTANI, Tamotsu et al. (JP)
Tamotsu Otani (JP)
Tamotsu Otani (JP)
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