Title:
FLUX AND SOLDER PASTE
Document Type and Number:
WIPO Patent Application WO/2019/132003
Kind Code:
A1
Abstract:
Provided is flux in which solder wettability can be maintained and with which it is possible to suppress the amount of residue after soldering and realize low residue. This flux includes 65-99 wt% of a solvent, and also includes 1-13 wt% of: a dimer acid that is a reaction product of oleic acid and linoleic acid; a trimer acid that is a reaction product of oleic acid and linoleic acid; a hydrogenated dimer acid obtained by adding hydrogen to a dimer acid that is a reaction product of oleic acid and linoleic acid; a hydrogenated trimer acid obtained by adding hydrogen to a trimer acid that is a reaction product of oleic acid and linoleic acid; or two or more selected from a dimer acid that is a reaction product of oleic acid and linoleic acid, a trimer acid that is a reaction product of oleic acid and linoleic acid, hydrogenated dimer acid obtained by adding hydrogen to a dimer acid that is a reaction product of oleic acid and linoleic acid, and a hydrogenated trimer acid obtained by adding hydrogen to a trimer acid that is a reaction product of oleic acid and linoleic acid.
Inventors:
KAWASAKI HIROYOSHI (JP)
SHIRATORI MASATO (JP)
KAWANAGO TOMOHISA (JP)
SHIRATORI MASATO (JP)
KAWANAGO TOMOHISA (JP)
Application Number:
PCT/JP2018/048467
Publication Date:
July 04, 2019
Filing Date:
December 28, 2018
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
B23K35/363; B23K35/26; C22C13/00
Domestic Patent References:
| WO2006025224A1 | 2006-03-09 |
Foreign References:
| JP2005144518A | 2005-06-09 | |||
| JP2013188761A | 2013-09-26 | |||
| JP2007532321A | 2007-11-15 | |||
| JP6160788B1 | 2017-07-12 |
Attorney, Agent or Firm:
YAMAGUCHI INTERNATIONAL PATENT FIRM (JP)
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