FLUX, SOLDER PASTE, SOLDERING PROCESS, METHOD FOR PRODUCING SOLDERING PRODUCT, AND METHOD FOR PRODUCING BGA PACKAGE

WIPO Patent Application WO/2019/172410

A1

Provided are: a flux which contains no reducing agent or no activator and does not remain on a solder joint; and a solder paste prepared using the flux. The flux according to the present invention contains: a first solvent of which the temperature at which the mass becomes zero as measured by thermogravimetry at a nitrogen flow rate of 0.2 to 0.3 L/min. and a temperature raising rate of 10°C/min. is 180°C or higher and lower than 260°C; a second solvent of which the temperature at which the mass becomes zero as measured by thermogravimetry at a nitrogen flow rate of 0.2 to 0.3 L/min. and a temperature raising rate of 10°C/min. is 100°C or higher and lower than 220°C; and a fatty acid amide. The content of the first solvent is smaller than that of the second solvent. The flux contains no reducing agent for reducing and removing an oxide film on the surface of a solder or no activator for improving the reducibility, and a mixture of the flux with a solder powder can be used as a solder paste.

JP2646400	[Title of Invention] Cream Soldering
JP2000176678	CREAM SOLDER AND PACKAGING PRODUCT USING IT
JPH06285682	FLUX COMPOSITION AND ALUMINUM MATERIAL FOR BRAZING

SHIRAISHI ARISA (JP)
OZAWA NAOTO (JP)
SUZUKI TAKAYUKI (JP)
FURUSAWA MITSUYASU (JP)

PCT/JP2019/009284

September 12, 2019

March 08, 2019

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ORIGIN CO LTD (JP)
KOKI KK (JP)

B23K35/363; B23K1/00; B23K1/008; B23K35/26; C22C13/00

WO2017057651A1	2017-04-06
WO2017057651A1	2017-04-06
WO2017057651A1	2017-04-06

JP2017192987A	2017-10-26
JP6160788B1	2017-07-12
JP6337349B1	2018-06-06
JP2018043396A	2018-03-22

See also references of EP 3763477A4

MIYAGAWA, Teiji et al. (JP)

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