FLUID SUPPLY SYSTEM, SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

WIPO Patent Application WO/2024/085000

A1

A fluid supply system according to one embodiment of the present disclosure supplies a fluid into a process chamber in which a substrate is processed, and this fluid supply system comprises: a first fluid supply unit which has a first supply valve and supplies a first fluid; a second fluid supply unit which has a second supply valve and supplies a second fluid; a fluid supply path which is connected to the first fluid supply unit, the second fluid supply unit and the process chamber, and supplies the first fluid and the second fluid into the process chamber; a heating mechanism which heats the first fluid and the second fluid, while being provided on the fluid supply path at a position that is in the downstream of the positions at which the first fluid supply unit and the second fluid supply unit are connected to the fluid supply path; and a control unit which controls those units of this fluid supply system. The control unit executes: a process in which the second supply valve is opened so as to supply the second fluid, which has been heated by the heating mechanism, into the process chamber when the first fluid is not supplied into the process chamber; and a process in which the second supply valve is closed so as to stop the supply of the second fluid into the process chamber before the substrate is carried into the process chamber. The second fluid supply process comprises a step for setting the set temperature of the heating mechanism to the same temperature as the set temperature of the heating mechanism at the time when the firs fluid is supplied into the process chamber.

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HAYASHIDA TAKAHIRO (JP)
NAKASHIMA MIKIO (JP)
UMEZAKI SHOTA (JP)

PCT/JP2023/036501

April 25, 2024

October 06, 2023

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TOKYO ELECTRON LTD (JP)

H01L21/304

WO2022196384A1	2022-09-22
WO2012165377A1	2012-12-06

JP2009038328A	2009-02-19
JP2011187570A	2011-09-22
JP2020025013A	2020-02-13
JP2017059642A	2017-03-23
JP2021503714A	2021-02-12

ITOH, Tadashige et al. (JP)

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