Title:
FLEXIBLE COPPER CLAD LAMINATE AND METHOD FOR PREPARING SAME
Document Type and Number:
WIPO Patent Application WO/2020/009388
Kind Code:
A1
Abstract:
A flexible copper clad laminate and a method for producing same are disclosed. The flexible copper clad laminate comprises: a non-conductive polymer substrate; a polymer-containing adhesive layer positioned on at least one surface of the non-conductive polymer substrate; a nickel-containing plating layer positioned on one surface of the polymer-containing adhesive layer; and a metal plating layer positioned on one surface of the nickel-containing plating layer.
Inventors:
LEE YONG HO (KR)
JEONG WOO DEUK (KR)
LEE BYEONG GUK (KR)
LEE JEONG DEOK (KR)
JEONG WOO DEUK (KR)
LEE BYEONG GUK (KR)
LEE JEONG DEOK (KR)
Application Number:
PCT/KR2019/007947
Publication Date:
January 09, 2020
Filing Date:
July 01, 2019
Export Citation:
Assignee:
TORAY ADVANCED MAT KOREA INC (KR)
International Classes:
C23C18/16; C09J133/00; C09J163/00; C09J167/00; C09J175/04; C09J183/04; C23C18/20; C23C18/32; C25D3/38
Foreign References:
| JP2005193400A | 2005-07-21 | |||
| KR20170071205A | 2017-06-23 | |||
| JP2006175634A | 2006-07-06 | |||
| JP4026596B2 | 2007-12-26 | |||
| US20120037405A1 | 2012-02-16 |
Attorney, Agent or Firm:
Y.P.LEE, MOCK & PARTNERS (KR)
Download PDF: